The global low dielectric materials market size is expected to grow from USD 1.7 billion in 2022 to USD 2.4 billion by 2027, growing at a CAGR of 6.7%



As governments and private organizations are stepping up the development of 5G network across the world, major mobile companies such as Apple, Samsung, Oneplus, Vivo, and Xiaomi have been focusing on developing 5G-compliant mobiles.

New York, July 7 2022 (GLOBE NEWSWIRE) — announces the publication of the report “Low Dielectric Materials Market by Type, Material Type, Application and Region – Global Forecast to 2027” –
This factor is expected to drive the growth of the low dielectric materials market. Additionally, with the demand for low losses in communications growing, the need for low dielectrics in antennas and microelectronics is expected to propel the market to new heights. However, the high cost of these materials compared to traditional materials is expected to be a critical impediment to market growth in the near future.

The excellent heat resistance ability is the main reason for the fastest growth of thermosetting resins.

Thermosetting resins such as polyimide and cyanate esters are the fastest growing type of low dielectric materials in the overall market. These resins have excellent heat resistance capability and do not change shape with heat generation, making them a material of choice for fabricating devices such as microelectronics, antenna, and radomes.

On the other hand, ceramics are inexpensive and have good strength and toughness. They are widely employed in the manufacture of microelectronics and radome, which ultimately leads the segment to hold a considerable share in the global market.

Fluoropolymers are widely used in PCB manufacturing
Fluoropolymers such as PTFE, ETFE and others hold the largest market share, due to their low cost and excellent moldability. PTFE is a thermoplastic with properties similar to thermosetting polymers.

It changes shape but at a very slow rate when applied with heat, making it suitable for PCB fabrication. ETFE and other fluoropolymers are used to manufacture wires and cables on a large scale, thus taking the market to new heights.

On the other hand, liquid crystal polymers are gaining popularity for manufacturing microelectronics. With the demand for electronics downsizing being a trend in the global industry, the demand for these polymers is expected to multiply in the near future.

The growing adoption of mobiles and smart devices has boosted the demand for PCBs.
An increase in sales of mobiles and smart devices, especially in developing economies like China and India, with 5G compatibility, has boosted the demand for PCBs. In addition, PCBs not only play a very important role in the operation of common electronic devices such as televisions, refrigerators and washing machines, but they are also eminent for the operation of high-end devices such as missiles. and satellites, which makes the application segment holds the largest share. low demand for dielectric materials.

Asia-Pacific is expected to register the highest growth during the forecast period.
Asia-Pacific is expected to register the highest growth over the forecast period owing to the large electronics industry. The region consists of countries such as China, Taiwan, Japan, and South Korea, which are among the largest electronics producing countries in the world.

These countries offer substantial growth opportunities for manufacturers of low-dielectric materials to produce electronic solutions. Furthermore, the expansion of 5G and other telecommunications initiatives are expected to further boost the demand for these materials in the near future in the region.

In-depth interviews were conducted with chief functional officers (CXOs), chief marketing officers, chief innovation and technology officers, and executives from various key organizations operating in the low dielectric materials market.

• By type of business: level 1: 55%, level 2: 27% and level 3: 18%
• By designation – Level D: 18%, Level C: 36%, Other: 46%
• By region: Europe: 26%, APAC: 31%, North America: 34%, Rest of the world: 9%
The low dielectric materials market includes major players such as Huntsman Corporation (US), SABIC (Saudi Arabia), Asahi Kasei (Japan), Zeon Corporation (Japan), Chemours Company LLC (US), DIC Corporation (Japan), Arkema (France), Mitsubishi Corporation (Japan), Showa Denko (Japan), Dow (United States), Shin Etsu Chemical Co. Ltd. (Japan), Olin Corporation (USA), Celanese Corporation (USA) and Solvay (Belgium).

Research Coverage:
The market study covers the Low Dielectric Materials market and its segments. It aims to estimate the market size and the growth potential of this market based on type, material type, application and region.

The study also includes an in-depth competitive analysis of key market players, their company profiles, key observations related to product and business offerings, recent developments, and key market strategies.

Key Benefits of Purchasing the Report:
The report will assist leaders/new entrants in this market with information on the closest approximations of revenue figures for the overall Low Dielectric Materials market and sub-segments. Stakeholders will be able to understand the competitive landscape and get more insights on how to better position their businesses and plan suitable go-to-market strategies.

It will also help stakeholders to understand the pulse of the market and provide insights into the key market drivers, restraints, and opportunities.
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